產品特色
DLC-MCPCB是銀河製版印刷有限公司獨有的專利產品。類鑽石鋁基板通常用在高功率高熱密集度LED導熱上,利用類鑽石碳(Diamond-like Carbon)鍍層的超高導熱特性,取代傳統銅鋁基板中間的介電層。導熱係數K值可達到475W/mk,是市面上傳統鋁基板的100倍以上。
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運用端圖片
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DLC相關專利
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美國專利
Publication Number : US 20060202224 A1 Substrate Structure For Light-emitting Diode Module
台灣專利
發明專利: I356657 電路基板之結構