3D Printable Dielectric for RF Application

Original article is from PCB Dictionary: Links

 28 January, 2022  |  Editorial Team

“Rogers Corporation Launches Radix 3D Printable Dielectrics at the IPC APEX EXPO 2022

Rogers Corporation, a global leader in engineered materials, launched its Radix 3D Printable Dielectrics family of products at the IPC APEX EXPO 2022 at the San Diego Convention Center in San Diego, CA. The IPC APEX EXPO is the leading event for the printed circuit board and electronics manufacturing and assembly industry, providing a full technical conference along with the exhibitor expo.

Rogers Corporation’s Radix 3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.

The new materials are intended for use as RF materials in applications where new geometric freedom can enhance the figure of merits of an RF system, such as gradient dielectric constant (GRIN) structures and other complex three-dimensional parts. The Radix 3D Printable Dielectrics offer the industry a way to manufacture systems and components at a scale that could not be made with traditional fabrication methods. Radix materials are available directly from Rogers Corporation and our 3D printing partners.

Click here to learn more about Radix 3D Printable Dielectrics.”