PCB

Procees Flow Chart

Procees Flow Chart

Capability

ItemStandardCapability
Dimension
Panel Size300mm x 400mm410mm x 610mm
Layer Count1 ~ 41 ~ 16
Material
FR 4TG 140TG 170 (High TG)
CEM 3TG 140TG 140
MCPCBAluminum PCBDiamond-liked Carbon- MCPCB (DLC-MCPCB)
IsolaAll Series of IsolaAll Series of Isola
Thickness
Finished Board Thickness0.2mm ~ 5.0mm0.15mm
Minimum Core Thickness0.08mm0.07mm
Finished Thickness Tolerance± 0.15mm± 0.1mm
Copper Foil Weight
Copper Foil Weights Internal0.5~ 2 ounce 1/3~ 3 ounce
Copper Foil Weights External0.5~ 2 ounce 1/3~ 3 ounce
Drilling
Minimum Drilled Hole Size Finished0.3mm0.15mm
Hole Size (Normal)0.2mm0.15mm
Tolerance
Plated Hole Tolerances (+/-)0.076mm(0.003")0.05mm
Non Plated Hole Tolerances (+/-)0.05mm(0.002")0.05mm
Diameter Tolerances (+/-)0.13mm(0.005")0.1mm
Surface Finished
LF-HASL/HASL/Immersion Gold/Immersion Tin/OSP(Entek )/Carbon Ink /ENIG
Lines, Spaces & Pad Diameters
Inner Layer Line Width5 mil4 mil
Inner Layer Spacing5 mil4 mil
Outer Layer Line Width5 mil4 mil
Outer Layer Spacing5 mil4 mil
O/S Test Pitch0.5 mm0.5 mm
Registration0.076mm (0.003")0.05mm
Solder Mask
Minimum Mask Clearance ( LPI )0.05mm0.04mm
Solder Mask ColorGreen/Yellow/Black/Blue/Red
Minimum Solder Mask Dam0.076 mm0.05 mm
Others
Legend ColorGreen/Yellow/Black/Blue/Red
Warpage and Twist1%0.7%
Special Process
Board Edge PlatingYesYes
Hole Aspect Ratio8 to 16 to 1
HDINoYes
Semi-Routing HoleYesYes